BI-LEVEL IDC TERMINATION
Description
1.27*2.54mm wire-mount IDC socket (A53) & dip plug (A53a) are optional.
Compared with standard fine pitch connector, BI-LEVEL (double layers) IDC termination design increases min.
Insulation Resistance up to 3000MΩ min. and Dielectric Withstanding Voltage up to 500V AC for 1 minute.
More importantly, high performance IDC termination will improve signal integrity.
For IDC socket type customers could consider use strain relief and mating fine pitch shrouded header of Straight (180 degree), R/A (90 degree) or SMT version (C96, C96a and C96b).
Learn More...
1.27*2.54mm wire-mount IDC socket (A53) & dip plug (A53a) are optional.
Compared with standard fine pitch connector, BI-LEVEL (double layers) IDC termination design increases min.
Insulation Resistance up to 3000MΩ min. and Dielectric Withstanding Voltage up to 500V AC for 1 minute.
More importantly, high performance IDC termination will improve signal integrity.
For IDC socket type customers could consider use strain relief and mating fine pitch shrouded header of Straight (180 degree), R/A (90 degree) or SMT version (C96, C96a and C96b).
Learn More...
Compared with standard fine pitch connector, BI-LEVEL (double layers) IDC termination design increases min.
Insulation Resistance up to 3000MΩ min. and Dielectric Withstanding Voltage up to 500V AC for 1 minute.
More importantly, high performance IDC termination will improve signal integrity.
For IDC socket type customers could consider use strain relief and mating fine pitch shrouded header of Straight (180 degree), R/A (90 degree) or SMT version (C96, C96a and C96b).
Learn More...
